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[Research] Examination of Copper Etching on Substrates in Lead-Free Solder Reflow

Published results of the investigation into the changes in copper thickness of the substrate during lead-free solder reflow processing.

This document presents the experimental methods and results of investigating the changes in copper thickness of substrates during lead-free solder leveling processing. During lead-free solder leveling, a phenomenon known as "copper eating" can be observed, which affects the copper thickness of the substrate. We conducted measurements to determine how much lead-free solder increases compared to eutectic solder by varying conditions such as temperature. While it cannot be said that this applies universally to all substrates, we hope it can serve as a guideline. 【Contents】 ■ Purpose ■ Experimental Methods ■ Experimental Results ■ Discussion ■ Summary ■ Future Challenges *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others

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Introduction to Basic Knowledge: "Handa Leveler"

Short processing time and inexpensive compared to other plating. Good wettability of solder during assembly.

The "Handa Leveler" is designed to apply a solder coat on the copper surface that forms the land area of printed circuit boards, with the aim of enhancing surface protection and wettability during assembly. The board is immersed in molten solder, and when it is pulled up, high-temperature air is blown from an air knife located above the solder tank to remove excess solder from the board holes, pad surfaces, and resist. This process ensures that only the copper surface is coated with solder. 【Features】 ■ Short processing time allows for high processing capacity ■ Relatively inexpensive ■ Good wettability of solder during assembly ■ High storage stability ■ Reworkable *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts

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