[Research] Examination of Copper Etching on Substrates in Lead-Free Solder Reflow
Published results of the investigation into the changes in copper thickness of the substrate during lead-free solder reflow processing.
This document presents the experimental methods and results of investigating the changes in copper thickness of substrates during lead-free solder leveling processing. During lead-free solder leveling, a phenomenon known as "copper eating" can be observed, which affects the copper thickness of the substrate. We conducted measurements to determine how much lead-free solder increases compared to eutectic solder by varying conditions such as temperature. While it cannot be said that this applies universally to all substrates, we hope it can serve as a guideline. 【Contents】 ■ Purpose ■ Experimental Methods ■ Experimental Results ■ Discussion ■ Summary ■ Future Challenges *For more details, please refer to the PDF document or feel free to contact us.
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